Micromachining of plates in oriented silicon
نویسندگان
چکیده
منابع مشابه
Micromachining of {111} plates in 〈001〉 oriented silicon
There are basically two ways to etch silicon: dry and wet chemical etching. In micromachining, the control of the shape of the structure is accomplished by anisotropic etching through mask openings. The anisotropy of wet chemical etching is related to the crystal structure of silicon, while that of dry etching stems from the momentum of ions impinging the substrate. The latter gives us much mor...
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ژورنال
عنوان ژورنال: Journal of Micromechanics and Microengineering
سال: 1998
ISSN: 0960-1317,1361-6439
DOI: 10.1088/0960-1317/8/2/015